Browse NQ Pack style pin
Browse TQ Pack style pin
The PolyPod is the most versatile QFP adapter line in the
industry. The adapters can be used as either an emulator interface,
as a logic analyzer interface, or even as a surface mountable
The user surface mounts the adapter base on the target board
in place of the IC to
be tested or emulated. The adapter base is ready to accept
the actual IC if so desired, depending on the application.
Attach the emulator, utilizing the emulator interface
cover. The emulator cable plugs directly into the cover through
an optional receptacle. The user can install the actual IC
if the emulator requires it.
Install the actual IC into the base and connect a logic
analyzer through the emulator interface cover and an interface
board assembly. (The interface board assembly is available
With the actual IC installed into the adapter base place
the IC socket cover over the adapter and you are ready to
ship the finished product.
The flexibility of this adapter line allows other options,
dictated by the requirements of the application.
Part number example: BASE-NQ-208Q5-SMT
*NOTE: The pad
layout recommendations are for the adapters only. If users
intend to solder an actual package on the target, they must
consider the physical footprint of that package. Some packages
have much larger footprints, where footprint is defined as
"Tip to Tip dimension minus the package size", in
FP = T - A as illustrated on the IC
package diagram below.
The American (JEDEC) and Japanese (EIAJ) standardization
comities defined the following footprints:
2.0 mm, 2.6 mm, 3.2 mm, 3.9 mm
In other words, a package with a 3.9 mm footprint and a body
size of 28 mm will have a "tip to tip" dimension
(T) of 31.9 mm. The recommended X/Y dimension for that package
would be a minimum of 33.9 mm.The recommended X/Y dimensions
in our table for that size is only 31.0 mm.